Agenda

Logic NVM 2008 -
the Signature Conference on non-volatile memory
Wednesday, June 18, 2008, Santa Clara, CA

Join us for our third annual Logic NVM event, bringing the industry's thought leaders and innovators together to explore how logic nonvolatile memory (NVM) is enabling tomorrow's electronics and intensifying your competitive landscape.

This signature event - which doubled in attendance in its first two years and is projected to reach more than 200 this year– will consist of technical tracks, a high profile keynote address to start the event off, and a panel discussion that focuses on providing expert opinions and answers to attendee questions.



    Time     Event
   8:30 – 9:30am Registration and Breakfast. Exhibits open
   9:30 – 10:30am Keynote
Room: Santa Clara Ballroom

Dr. Yoon Lee
Managing Director of Product Innovation Team (PIT)
Samsung Electronics’ Global Marketing Operation
   10:30 – 11:30am Keynote Panel Discussion
Room: Santa Clara Ballroom

Configuring Your NVM
The starting point for embedded non-volatile memory can be confusing for a designer. Lots of questions seem to crop up. For example, what exactly should you be embedding into that memory die, and what are the tradeoffs that come with those decisions. Should you be thinking about embedding the memory into the logic, or vice versa, and why? Should your memory include a one-time programmable (OTP) section or should it be "multiple-time" programmable? What are the strengths and weaknesses of adding just a few bytes of memory, and what are the "must-have" features? These are the questions that will be answered by this esteemed panel, as well as any others that you are welcome to ask.

Moderator: Alan Niebel, Founder and CEO of Web-Feet Research.
Panel:
Todd Humes, Vice President of Engineering IP products, Impinj
Charles Ng, Vice-President of Worldwide Sales & Marketing,
Kilopass Technology
Joel Rosenberg, Senior Director of Digital Consumer Marketing,
Virage Logic
Xerxes Wania, CEO and President, Sidense
   11:30 – 1:00pm Networking Lunch
Room: Cypress (lower level)
   1:00 – 1:40pm Breakout Sessions
Technology TrackRoom: Lafayette
Few-Times Programmable (FTP) Logic NVM
Speaker: Todd Humes, VP of Engineering IP products, Impinj
The architecture for a few-time programmable (FTP) NVM bridges the gap between one-time programmable (OTP) memories and high cycle count, high reliability multiple time programmable (MTP) NVM. Use models requiring lower write cycle counts (<100 cycles) will benefit in several ways: 1) higher memory density, 2) 100% factory testable, and 3) reprogrammability. The fundamental technology requirements for meeting these requirements such as intrinsic retention, error correction and cycling trade-offs will be discussed against traditional high cycle count NVM.

Applications TrackRoom: San Thomas
Cryptographic Authentication Through RSA Digital Signature Algorithms
Speaker: Al Hawtin, Elliptic Semiconductor
Cryptographic authentication through RSA digital signature algorithms are used both for secure boot and for anti-cloning technologies in SoC designs. Secure boot ensures that the system loads only the code which is factory authorized and prevents hackers from modifying the system code in Flash and taking control of the product for malicious reasons. Anti-cloning techniques use embedded secrets in the device to ensure that only authorized systems will function correctly. The presentation explains the cryptographic design used to achieve these features as well as the NVM solutions best suited to the task of storing the embedded secrets required for these two applications.

Integration TrackRoom: Lawrence
Design Selection Alternatives for Integrated Memory
Speaker: Gregory A. Quirk, Product Manager, TechOnline
Logic NVM is one of many different alternatives for designers to provide some memory capabilities without incorporating a separate component, such as an EEPROM or DRAM. But why would you choose logic NVM over another solution? How does it compare to popular choices like embedded flash and fuse/antifuse technologies? The presentation will provide an overview of these three solutions and provide comparison and contrasts between them using technical in depth detailed analysis from Semiconductor Insights. As well, an overview of the intellectual property (IP) for logic NVM will be discussed and some of the more open spaces for further development identified.
   1:50 – 2:30pm Breakout Sessions
Technology TrackRoom: Lafayette
More Information to Come

Applications TrackRoom: San Thomas
Logic NVM for Precision Analog and Timing Circuits in CMOS
Speaker: Michael S. McCorquodale, Ph.D., Chief Technical Officer, Mobius Microsystems
The use of high-resolution analog current, voltage and switched-capacitor trimming has proven critical to the development of Mobius’ self-referenced CMOS oscillator technology for quartz crystal replacement. Mobius’ components are the highest-accuracy all-CMOS frequency references on the market. The use of logic NVM in Mobius’ timing products is discussed within the general context of storing trimming and configuration coefficients for precision analog components.

Quality and Reliability TrackRoom: Lawrence
Logic NVM Technologies: IP Qualification Requirements
and Methods

Speaker: Pearl Cheng, Vice President of Engineering and
Operations, Kilopass
There are three primary categories of non-volatile memory technology developed on standard logic CMOS process technologies: fuse, anti-fuse, and floating gate. The intrinsic nature of all of three of these technologies is to either effect a physical, and, thereby, electrical change in a semiconductor material or to store a charge within a floating gate in order to store information. The storage mechanisms involve effects on CMOS device materials that are not necessarily intended by the wafer manufacturer. Although there is a substantial investment required, it is critical that Logic NVM IP vendors qualify their technologies in order to provide necessary quality and reliability assurances, as well as protections to the end customer. This presentation discusses the qualification requirements and methods needed for the qualification of Logic NVM IP technologies as well as the underlying benefit to the end customer provided with this qualification information.
   2:30 – 3:00pm Networking Break
   3:00 – 3:40pm Breakout Sessions
Quality and Reliability TrackRoom: Lafayette
Logic NVM with Sub 1 PPM Reliability
Speaker: Bin Wang, Ph.D., Technology Transfer Manager, Impinj
Product reliability can be enhanced by various design-for-reliability techniques such as redundancy, ECC, layout, etc. This talk focuses on first theoretical statistical analysis on product failure rate versus single floating gate (FG) failure rate for FG logic NVM (LNVM). It shows step-by-step how reliability is enhanced. Second, it demonstrates that sub 1 PPM reliability can be achieved for LNVM with 70 tunneling oxide based on experimental data. Lastly, trade-offs between reliability levels and architectures are discussed.

Quality and Reliability TrackRoom: San Thomas
Reliability Characterization Challenges and Methodologies
for OTP Memory Arrays

Speaker: Wlodek Kurjanowicz, CTO, Sidense
Embedded one-time programmable (OTP) memory has been employed for several years as an inexpensive and relatively easy-to-implement storage mechanism. Traditional technologies such as ROM and eFuse have been in widespread use, but limitations with regard to field-programmability, long-term reliability and storage security have prompted several vendors to investigate other OTP mechanisms for implementing embedded data and code storage. This has led to the introduction by several vendors of antifuse-based embedded OTP memory IP, some using oxide breakdown as a way to program memory bits. This tutorial reviews OTP qualification challenges and describes an effective reliability test methodology used for memory arrays based on a unique split-channel OTP bit cell. The tutorial will also include associated silicon test results.

Testability TrackRoom: Lawrence
Embedded Non-Volatile Memory with Efficient Testability
Speaker: TBD
An Embedded Non-Volatile multi-programmable solution has been developed with several features that facilitate efficient testability. The Page programming feature provides a very efficient method of storing many bits in parallel thereby minimizing test time and cost. The Margin mode provides a simple expedient method of monitoring the program margin for all bits in the array. The Vt distribution test allows for the measurement of programming threshold voltages for every individual bit thereby facilitating efficient product qualification. The product has been successfully developed in 130 nm and 90 nm technologies and results will be shown.

Quality and Reliability TrackRoom: Lawrence
Reliable Multi-time Programmable NVM on Advanced Process Nodes
Speaker: Dave Sowards, VP NVM Products, Virage Logic
Floating poly based NVM has been successfully implemented in a range of pure logic processes from 180nm down to 90nm. In 90nm process and below there is shift from 3.3V IO (70A oxide) to 2.5V IO (50A oxide). The viability of a floating gate NVM implementation for thin oxide manufactured on a standard CMOS process will be demonstrated. Specific topics will include architecture, endurance cycling, retention and device reliability.
   3:50 – 4:30pm Breakout Sessions
Quality and Reliability TrackRoom: Lafayette
Design Approach for Highly Reliable Logic NVM Solution
Speaker: - TBD, eMemory
Logic NVM solution has been widely adopted in variant semiconductor applications recently, providing IC designers a convenient way to flexibly achieve on-chip data storage or to trim circuit performance. Its advantages may be overshadowed, however, if logic NVM solution complicates design work, incurs higher failure rate, or causes extra testing steps because of insufficient reliability. Thus, a high-performance, high-reliability memory design is the key to successful logic NVM integration. In this presentation, eMemory introduces a simply yet extremely robust memory design which provides easy user access, negligible production fail rate as well as a gateway for logic NVM adoption in automotive applications.

Testability TrackRoom: Lawrence
Production Test Methodology for Manufacturable NVM
Speaker: Martin Niset, Product and Test Engineering Manager, Impinj
The ideal production test flow guarantees that the device under test meets all the datasheet specifications while keeping test time at a minimum. Achieving such a feat with an NVM array presents many challenges including: (1) validating the electrical performance across temperature, (2) guaranteeing key end of life reliability metrics such as data retention and (3) managing test time regardless of the array size. This paper addresses test strategy and unique Design For Test features required to meet those challenges.
   4:30 – 5:00pm Closing Remarks
Room: Santa Clara Ballroom

Conference Tracks

The Technology Track looks at the underlying physics and process technologies that are supporting Logic NVM today, tomorrow, and well into the future.

The Applications Track includes real examples of how Logic NVM is being used in Power Management, Digital Rights Management, and Silicon Clocks. Expect more of the same this year with users of Logic NVM IP providing examples of the benefits and opportunities enabled by integrating Logic NVM in their design.

The Integration Track targets the designer who is in the trenches making sure that the Logic NVM IP is integrated properly into the overall design. We will review the common pitfalls associated with Logic NVM integration, give advice on how to plan the integration process to ensure a smooth and successful product development, and explore some of the lessons that others have learned while integrating Logic NVM into their design.

The Quality and Reliability Track will dig into the qualification and characterization methodologies that are unique to embedded NVM in general and Logic NVM in particular. This track will cover topics ranging from industry standards for qualification testing to reliability modeling efforts and techniques.

The Testability Track will look into how to get your finished design into full production by minimizing overall test cost, while still meeting all your required quality and reliability metrics. We will look at common trade-offs of test time versus coverage and how to integrate the Logic NVM test requirements into your overall SoC test plan.


Founding Sponsor:
Platinum Sponsors:
eMemory     Kilipass
Sidense       Virage Logic

 
Presented by:

TechInsights
 
Media Sponsors:

EE Times        Embedded Systems Design        TechOnline
Design and Reuse

 


 
Association Sponsor:
Witi